Technical Program Committee
Abdur Rakib, Coventry University, United Kingdom
André Constantino Da Silva, IFSP & NIED/UNICAMP, Brazil
Chao Qian, University of Duisburg-Essen, Germany
Chen Zhu, East China Normal University, China
Christoph Stach, University of Stuttgart, Germany
Daniela Micucci, University of Milano–Bicocca, Italy
Di Duan, The Chinese University of Hong Kong, Hong Kong (China)
Donghui Dai, Hong Kong Polytechnic University, Hong Kong (China)
Endrowednes Kuantama, Macquarie University, Australia
Fukuharu Tanaka, RIKEN, Japan
George Xylomenos, Athens University of Economics and Business, Greece
Haoxiang Yu, The University of Texas at Austin, United States
Hirohiko Suwa, Nara Institute of Science and Technology, Japan
Hongkai Chen, The Chinese University of Hong Kong, Hong Kong (China)
Hua Deng, Changsha University, China
Huanqi Yang, Huawei Leibniz Research Center, Hong Kong (China)
Ismail Hassan, Oslo Metropolitan University, Norway
Jiongchi Yu, Singapore Management University, Singapore
Jože Rožanec, Jožef Stefan Institute, Slovenia
Kallol Krishna Karmakar, Deakin University, Australia
Lei Zhang, East China Normal University, China
Liantao Wu, East China Normal University, China
Manato Fujimoto, Osaka Metropolitan University, Japan
Ningning Hou, Macquarie University, Australia
Peter Zdankin, University of Duisburg-Essen, Germany
Pierre Leone, University of Geneva, Switzerland
Przemysław Falkowski-Gilski, Gdansk University of Technology, Poland
Qifan Wang, Durham University, United Kingdom
Rajan Shankaran, Macquarie University, Australia
Sangsu Lee, Google, United States
Takuya Fujihashi, The University of Osaka, Japan
Tao Chen, City University of Hong Kong, Hong Kong (China)
Tao Ni, King Abdullah University of Science and Technology, Saudi Arabia
Tatsuya Amano, Osaka University, Japan
Teruhiro Mizumoto, Osaka University, Japan
Tiehua Zhang, Tongji University, China
Weizhan Jing, Institute of Information Engineering, Chinese Academy of Sciences, China
Weizhi Meng, Lancaster University, United Kingdom
Wentao Xie, The Hong Kong University of Science and Technology, Hong Kong (China)
Xiujin Shi, Donghua University, China
Yi-Chao Chen, Shanghai Jiao Tong University, China
Yuki Matsuda, Okayama University, Japan
Zehua Sun, National University of Singapore, Singapore

